Amkor expands investment in new semiconductor campus in Arizona
Amkor Technology, Inc., a provider of semiconductor packaging and testing services, announced the expansion of its investment in a new advanced packaging and testing campus in Peoria, Arizona. The total investment in the project increased from $500 million to $700 million and will be executed in two phases, including additional clean room space and a second packaging and testing facility.
The center, which is expected to be completed in 2027 and begin operations in early 2028, will offer more than 750,000 square feet of clean rooms and up to 3,000 high-quality jobs. The facilities will be designed to support advanced packaging and testing technologies, complementing TSMC’s wafer manufacturing and serving customers such as Apple and NVIDIA.
The project is supported by the CHIPS Act for the US, the Advanced Manufacturing Investment Tax Credit, and state and local government support. The campus will incorporate smart factory technologies and scalable production lines to meet market demands for AI, high-performance computing, mobile communications, and automotive applications.
Local and federal officials highlighted the project as a boost to Arizona’s semiconductor industry. According to Amkor CEO Giel Rutten, the new facility is designed to “meet the most advanced customer needs and contribute to the future of semiconductor manufacturing in the United States.”
Senators and local representatives noted that the investment will contribute to job creation, strengthen the supply chain, and position Arizona as a key center for advanced manufacturing. The groundbreaking ceremony brought together government officials, business leaders, and community stakeholders, marking the formal start of the project.
The Peoria campus is planned to be the first high-volume advanced packaging facility in the U.S., with a view to consolidating Arizona’s position in the global semiconductor supply chain and maintaining the sector’s competitiveness nationally and internationally.
